Description

Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / EMMC

Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon

RELIFE RL-044 Android CPU Tinned BGA Reballing Stencil Kits Set Solder for Android Kirin Qualcomm Hisilicon Snapdragon Dimensity

Features:

• Precise alignment/Fast and convenient/High-temperature resistance/No deformation
• The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing
• It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
• Ultra-thin design, better fit of tin planting, continuous bending, and full toughness
• Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
• High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance so that each tin point is heated evenly
• The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls

Suitable Models:

• Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
• Compatible with Dimensity 810/MT6833V/720/MT6853V/800/MT6873V/900/MT6877V/1000/MT6885Z/9000/MT6983Z
• Suitable for Hisilicon 710 HI6260/810 HI6280/960 HI3660/970 HI3670/980 HI3680/985/820 HI6290/L/990 HI3690 5G/Kirin 990/4G HI3690/9000 HI36A0
• For BGA 134/153/162/178/211/254
• Applicable to/Hisilicon Qualcomm RAM upper layer/Kirin 9000 upper layer/Kirin 970/980/990 upper layer/Snapdragon 865+/870/888 upper layer

Package includes:

• 35 x Stencil