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MIJING Z21 MAX CPU IC CHIP REBALLING STENCIL STATION FOR IPHONE ANDROID

2,799.00

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MIJING Z21 MAX CPU IC CHIP REBALLING STENCIL STATION FOR IPHONE ANDROID
Features:
Mijing Z21 Max Cpu Ic Chip Reballing Stencil For
Iphone A8-A12 A13 A14 A15 A16 Hisilicon
Qualcomm Snapdragon Bga Cpu Reballing Stencil
Automatic precise positioning
The new magnetic dynamic original positioning
Strong magnetic force automatic clamping

Out of stock

Description

MIJING Z21 MAX CPU IC CHIP REBALLING STENCIL STATION FOR IPHONE ANDROID

MIJING Z21 MAX Chip Tin Planting Table FOR
iPHONE A8-A12 A13 A14 A15 A16 Hisilicon
Qualcomm Snapdragon BGA CPU Reballing Stencil

Features:

  • Automatic precise positioning
  • The new magnetic dynamic original positioning
  • Strong magnetic force automatic clamping

Installation Method:

  • Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
  • Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:

  • 1 x Tin planting platform set(choose iPhone set/ android set)

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