IP14 4in1 PCB BGA Platform

$30.41

IP14 4in1 PCB BGA Platform
Features:
1. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
2. 4 in 1 middle layer tin planting. Precise positioning, fast tin planting.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.

Description

IP14 4in1 PCB BGA Platform

AMAOE IP14 Middle Frame Reballing Platform For iPhone 14 Series

Description

Amaoe iPhone 14 series 4 in 1 Motherboard Mid-Frame BGA Reballing Stencil Positioning Platform For iPhone 14/14 Plus/14 Pro/14 Pro Max Middle Layer Tin Planting Reballing Repair. Amaoe IP14 4-in-1 middle layer reballing platform for iPhone 14 series.

Features:
1. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
2. 4 in 1 middle layer tin planting. Precise positioning, fast tin planting.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.

Option:
– 0.12mm iPhone 14 4 in 1 Middle Stencil
– 0.12mm iPhone 14 4 in 1 Positioning Plate
– 0.12mm iPhone 14/ 14 Plus Middle Stencil
– 0.12mm iPhone 14 Pro/14 Pro Max Middle Stencil
– Universal bases (with Tin Scraping Blade)