Features:

• LS4 glue removal and layering heating machine, tinning, chip glue removal, separation preheating, mainboard layering

• Multifunctional Repair, Glue Removal And Delamination: Large operating area, supports larger motherboard desoldering operations, convenient and fast

• Modular Design,Strong Compatibility: Can be switched freely according to needs,suitable for tinning, chip degumming, separation preheating, motherboard layering, etc

• Intelligent Digital Temperature Control: CNC precise temperature adjustment, starting from the current ambient temperature up to 380°C, according to different work needs, efficient use

• Rapid Heating And Even Heating: Specially made thickened aluminum plate, rapid heating, even heating, fast and efficient repair

• Can clamp everything uitable for mobile phone motherboards of various sizes

• Glue removal slot design: Deepened groove fixing angle, precise clamping

• Bilateral cooling vents: The heat dissipation holes on both sides effectively reduce the internal temperature of the fuselage

Specification:

• Brand: SUNSHINE

• Product name: Multi-function heating machine

• Model: LS4

• Working size: 70*111mm

• Product size: 155*130*50mm

• Packaging size: 160*148*68mm

• Net weight: 835g

• Gross weight: 960g

• Input voltage: AC110V/220V

• Frequency: 50/60Hz

• Input power: 220W

• Temperature range: Current ambient temperature ~380°C

Package includes:

• 1 x Host

• 1 x Power Cord