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Mijing KC8 Quicky Remove Maintenance Knife Set for Mobile Phone Motherboard Glue Removal
₹999.00 ₹1,249.00
MiJing KC8 Multi-function Quick Release Knife, specially crafted for effortless Mobile Phone Motherboard Glue Removal. Engineered with precision, the MIJING KC8 Maintenance Knife Handle Blade Set excels in IC Remove Glue Rework Blade tasks and CPU Disassemble Knife functionalities, featuring seamless interchangeability of blades.
Description
Mijing KC8 Quicky Remove Maintenance Knife Set for Mobile Phone Motherboard Glue Removal
Mijing KC8 Mobile Phone Repair Black CPU Glue Removal Blade Chip Scraper Pry Knife Motherboard Chip Shovel Carving Tools
Features:
Press the rebound structure, quickly remove the blade
Multi-functional glue removal knife, high-temperature resistance, corrosion resistance, high hardness, high toughness, fine high carbon elastic steel, pure hand polished
A variety of options to provide you with solutions to all kinds of maintenance problems, cutting black glue, side glue removal, motherboard glue removal, prying hard disk, etc.
Pure hand polishing, surface vacuum plating process, with strong corrosion resistance and high-temperature durability, and wear resistance
New blade design, rigid and flexible, with strength, more toughness
Fine high-carbon elastic steel blade grinding, toughness, rebound does not deform
Comfortable grip, with a universal ergonomic knife handle
Each piece of blade material is laser cut to ensure a high degree of product uniformity
Package includes:
1 x Handle
8 x Blades
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