MECHANIC iT3 PRO Preheating Platform For iPhone X-13 PRO MAX

9,499.00 10,999.00

MECHANIC iT3 PRO Preheating Platform For iPhone X-13 PRO MAX
Package 1: iT3 Pro host + X-12 Pro Max mold with stencil(4pcs) + universal mold + dot matrix CPU mold
Package 2: iT3 Pro host + X-13 Pro Max mold with stencil(6pcs) + universal mold + dot matrix CPU mold
Package 3: iT3 Pro host + 13 series mold with stencil(2pcs)
Package 4: iPhone 13 series mold with stencil only(2pcs)
Package 5: iT3 Pro host + 7-13 Pro Max rear camera mold
Package 6: iPhone 7-13 Pro Max rear camera mold only(2pcs)

3 in stock

Description

MECHANIC iT3 PRO Preheating Platform For iPhone X-13 PRO MAX

MECHANIC iT3 PRO Preheating Platform Motherboard Layer Preheating Table for iphone X XS 11 12 13 PROMAX IC CHIP BGA Heating Plat.

Mechanic iT3 Pro Intelligent Temperature Control Preheating Platform for iPhone X-13 Series Motherboard Chip

Options:-

Package 1: iT3 Pro host + X-12 Pro Max mold with stencil(4pcs) + universal mold + dot matrix CPU mold
Package 2: iT3 Pro host + X-13 Pro Max mold with stencil(6pcs) + universal mold + dot matrix CPU mold
Package 3: iT3 Pro host + 13 series mold with stencil(2pcs)
Package 4: iPhone 13 series mold with stencil only(2pcs)
Package 5: iT3 Pro host + 7-13 Pro Max rear camera mold
Package 6: iPhone 7-13 Pro Max rear camera mold only(2pcs)

Features:-

Used for iPhone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix Face ID repair, rear camera repair
Intelligent adjustable temperature, modular design
No air gun and no soldering iron, just plug and use
Multiple combination modules, good scalability, easy to expand new modules.
Host size: 12*14cm
Voltage 110V/220V
Layering, tin planting, bonding, desoldering, and glue removal is integrated, and it is equipped with controllable temperature/module expansion design / no air gun and no soldering iron I plug and play technology
Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
Modular design, multiple combination modules, good scalability, easy to expand new modules
Plug and play technology, the device supports hot-swap, making your work more efficient
Suitable for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini/13/13 Mini/13 Pro/13 Pro Max