Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform

$27.98

Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-13 Pro Max Motherboard Rework Tin Mesh Template Fixture
Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.

Description

Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform

Mechanic iBGA 13 Max Middle Frame BGA Reballing Platform For iPhone X-13 Pro Max Motherboard Rework Tin Mesh Template Fixture

Description

MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.

Features:
1. Anti-leakage tin barrier design.
2. High temperature does not allow the drum.
3. Strong magnetic automatic positioning, precision positioning.
4. Integrated, removable tin planting.
5. Positioning slot of the double-sided motherboard.
6. For iPhone 13/13mini/13 Pro/13 Pro Max.