i2C Q5 High Toughness Pry Knife Chip Repair Combination Kit

Description

i2C Q5 High Toughness Pry Knife Chip Repair Combination Kit for Mobile Phone Mainboard Repair

Features:

The blade is made of Japanese materials, with high toughness, high-temperature resistance, no deformation, etc.

5 blades with unique shape design, remove the edge glue, remove the chip, pry the CPU, suitable for various parameters with adhesive IC chip

iPhone and Android and Various mobile phone precision chip scene maintenance, only one set is needed to fix

With the unique light-grip handle design, non-slip, and no handshake, repair easier

Handle separated design, replace the blade as you like, more convenient and freely

Come with fine polishing sandpaper, you can polish the thickness of the blade according to your preference, you are the boss of your blade

Carbon chips repair blade,5 types of blade, applicable for various repair scene

High-temperature resistance, non-stick tin, fast removal of tin, scraping glue, pry IC/CPU, separation dot matrix

High-temperature resistance, no tin, can quickly separate tin points, remove glue remove tin, scraping glue

The blade is only 0.2mm thick, thin, and not easy to deform

The edge of the blade is smooth, not too sharp, and damages the motherboard, chip, etc

301 High-toughness magnetic steel sheet, 0.2mm thickness, full toughness, no deformation of rebound, can bend at will

Insert type installation, unscrew, take out the blade; tighten the screws and secure the blade, the handle and blade can be easily replaced on demand

With the unique light-grip handle design, non-slip, and no handshake, repair easier

Soft paper base,wear-resistant and tensile-resistant, not curled, durable

Electrostatic sand planting, grit more even, exquisite and tightened, wet and dry using, no fear of soaking in water

i2C Q5 High Toughness Pry Knife Chip Repair Combination Kit for Mobile Phone Mainboard Repair